Microfabrication of cavities in polydimethylsiloxane using DRIE silicon molds
نویسندگان
چکیده
منابع مشابه
VERY DEEP TRENCHES IN SILICON WAFER USING DRIE METHOD WITH ALUMINUM MASK
Abstract: In this paper, a DRIE process for fabricating MEMS silicon trenches with a depth of more than 250 m is described. The DRIE was produced in oxygen-added sulfur hexafluoride (SF6) plasma, with sample cooling to cryogenic temperature using a Plasmalab System 100 ICP 180 at different RF powers. A series of experiments were performed to determine the etch rate and selectivity of the some m...
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ژورنال
عنوان ژورنال: Lab on a Chip
سال: 2007
ISSN: 1473-0197,1473-0189
DOI: 10.1039/b714742b